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    Results for "BGA Publications Books"
    BGA Publications Books
    8 results
    Refine By
    Category
    Nonfiction (3)
    Professional & Vocational (2)
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    Paperback (4)
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      8 results
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      Reliability of ­RoHS-Compliant 2D and 3D ­IC Interconnects
      By Lau, John H.
      Reliability of ­RoHS-Compliant 2D and 3D ­IC Interconnects
      By Lau, John H.
      $284
      Through-Silicon Vias for 3D­ Integration
      By John H. Lau
      Through-Silicon Vias for 3D­ Integration
      By John H. Lau
      $356
      3D IC Integration and ­Packaging (Electronics)
      By Lau, John H.
      3D IC Integration and ­Packaging (Electronics)
      By Lau, John H.
      $437
      Ball Grid Array Technology ­ (Electronic Packaging and Interconnection)
      By John H. Lau
      Ball Grid Array Technology ­ (Electronic Packaging and Interconnection)
      By John H. Lau
      Currently
      Unavailable
      Flip Chip Technologies (Electronic Packaging and Interconnection)
      By Lau, John H.
      Flip Chip Technologies (Electronic Packaging and Interconnection)
      By Lau, John H.
      Currently
      Unavailable
      Microvias (Low Cost, High Density Interconnects (Electronic Packaging and Interconnection))
      By John H. Lau, Ricky S. W. Lee
      Microvias (Low Cost, High Density Interconnects (Electronic Packaging and Interconnection))
      By John H. Lau, Ricky S. W. Lee
      Currently
      Unavailable
      Advanced MEMS Packaging
      By Lau, John H., Lee, Cheng Kuo, C. S. Premachandran, Yu Aibin
      Advanced MEMS Packaging
      By Lau, John H., Lee, Cheng Kuo, C. S. Premachandran, Yu Aibin
      Currently
      Unavailable
      5th ICEG - Environmental ­Geotechnics (Opportunities, Challenges and Responsibilities for Environmental Geotechnics)
      By Hywel R. Thomas
      5th ICEG - Environmental ­Geotechnics (Opportunities, Challenges and Responsibilities for Environmental Geotechnics)
      By Hywel R. Thomas
      $453