Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.
Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.
Preface
1: Zhenan Bao: Recent Progress in Materials for Organic
Electronics
2: Kyungkon Kim, Guolun Zhong, Jung-Il Jin, Jung Ho Park, Seoung
Hyun Lee, Dong Woo Kim, Yung Woo Park, and Whikun Yi: PPV
Nanotubes, Nanorods, and Nanofilms as well as Carbonized Objects
Derived Therefrom
3: M.E. van der Boom and T.J. Marks: Layer-by-Layer Assembly of
Molecular Materials for Electrooptical Applications
4: Sung-Yeon Jang, Manuel Marquez, and Gregory A. Sotzing:
Oxidative Solid-State Cross-Linking of Polymer Precursors to
Pattern Intrinsically Conducting Polymers
5: T.H. Fedynyshyn, W.A. Mowers, R.R. Kunz, R.F. Sinta, M. Sworin,
A. Cabral, and J. Curtin: Fluorocarbon Polymer-Based Photoresists
for 157-nm Lithography
6: Toshiro Itani, Hiroyuki Watanabe, Tamio Yamazaki, Seichi
Ishikawa, Naomi Shida, and Minoru Toriumi: 157-nm Resist Materials
Using Main-Chain Fluorinated Polymers
7: Ronald L. Jones, Vivek M. Prabhu, Dario L. Goldfarb, Eric K.
Lin, Christopher L. Soles, Joseph L. Lenhart, Wen-li Wu, and Marie
Angelopoulos: Correlation of the Reaction Front with Roughness in
Chemically Amplified Photoresists
8: Joseph L. Lenhart, Daniel A. Fischer, Sharadha Sambasivan, Eric
K. Lin, Christopher L. Soles, Ronald L. Jones, Wen-li Wu, Dario L.
Goldfarb, and Marie Angelopoulos: Utilizing Near Edge X-ray
Absorption Fine Structure to Probe Interfacial Issues in
Photolithography
9: B. Voit, F. Braun, Ch. Loppacher, S. Trogisch, L.M. Eng, R.
Seidel, A. Gorbunoff, W. Pompe, and M. Mertig: Photolabile
Ultrathin Polymer Films for Spatially Defined Attachment of Nano
Elements
10: Martin Brehmer, Lars Conrad, Lutz Funk, Dirk Allard, Patrick
Theato, and Anke Helfer: Soft Lithography on Block Copolymer Films:
Generating Functionalized Patterns on Block Copolymer Films as a
Basis to Further Surface Modification
11: R.D. Miller, W. Volksen, V.Y. Lee, E. Conner, T. Magbitang, R.
Zafran, L. Sundberg, C.J. Hawker, J.L. Hedrick, E. Huang, M.
Tooney, Q.R. Huang, C.W. Frank, and H.-C. Kim: Nanoporous,
Low-Dielectric Constant Organosilicate Materials Derived from
Inorganic Polymer Blends
12: C. Tyberg, E. Huang, J. Hedrick, E. Simonyi, S. Gates, S.
Cohen, K. Malone, H. Wickland, M. Sankarapandian, M. Toney, H.-C.
Kim, R. Miller, W. Volksen, P. Rice, and L. Lurio: Porous Low-k
Dielectrics: Material Properties
13: Bianxiao Zhong and Eric S. Moyer: Ultra Low-k Dielectic Films
with Ultra Small Pores Using Poragens Chemically Bonded to Silozane
Resin
14: H. Craig Silvis, Kevin J. Bouck, James P. Godschalx, Q. Jason
Niu, Michael J. Radler, Ted M. Stokich, John W. Lyons, Brandon J.
Kern, Joan G. Marshall, Karin Syverud, and Mary Leff: Design of
Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in
Microelectronic Devices
15: Q. Jason Niu, Steven J. Martin, James P. Godschalx, and Paul H.
Townsend: Molecular Brushes as Templating Agents for Nanoporous
SiLK* Dielectric Films
16: Christopher L. Soles, Hae-Jeong Lee, Ronald C. Hedden, Da-wei
Liu, Barry J. Bauer, and Wen-li Wu: X-ray Reflectivity as a
Metrology to Characterize Pores in Low-k Dielectric Films
17: Sara N. Paisner and Joseph M. DeSimone: Micro- and Nanoporous
Materials Developed Using Supercritical CO2: Novel Synthetic
Methods for the Development of Micro- and Nanoporous Materials
Toward Microelectronic Applications
18: Masamitsu Shirai, Satoshi Morishita, Akiya Kawaue, Haruyuki
Okamura, and Masahiro Tsunooka: Thermally Degradable
Photocross-Linking Polymers
19: Robert K. Oldak and Raymond A. Pearson: Evaluation of Infrared
Spectroscopic Techniques to Assess Molecular Interactions
20: Zhuqing Zhang and C.P. Wong: Study on Metal Chelates as
Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow
Underfill Applications
21: Ying-Hung So, Phil E. Garrou, Jang-Hi Im, and Karou Ohba:
Benzocyclobutene-Based Polymers for Microelectronic
Applications
22: A.L.Cholli, S.K. Sahoo, D.W. Kim, J. Kumar, and A. Blumstein:
Formation of Nanocomposites by In Situ Intercalative Polymerization
of 2-Ethynylpyrdine in Layered Aluminosilicates: A Solid-State NMR
Study
Author Index
Subject Index
"Each chapter is well-illustrated and well-referenced and can
certainly serve to orient the scientist or engineer to these new
developments. This is a book that practising micro-engineers will
want to have as a reference."-- Materials World
"Each chapter is well-illustrated and well-referenced and can
certainly serve to orient the scientist or engineer to these new
developments. This is a book that practising micro-engineers will
want to have as a reference."-- Materials World
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